Supersedes:

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If a conflict occurs between the English and translated versions of this document, the English version will take precedence.

Supersedes:

J-STD-001F WAM1 -

February 2016 J-STD-001F - July 2014 J-STD-001E - April 2010 J-STD-001D - February 2005 J-STD-001C - March 2000 J-STD-001B - October 1996

J-STD-001A - April 1992

IPC J-STD-001G

Requirements for Soldered Electrical and Electronic Assemblies

Developed by the J-STD-001 Task Group (5-22a) of the Soldering Subcommittee (5-22) of the Assembly & Joining Committee (5-20) of IPC

Users of this publication are encouraged to participate in the development of future revisions.

Contact:

IPC

Table of Contents

| 1 | GENERAL ................................................................. | 1 | 2.6 | International Electrotechnical Commission ....... | 7 | |-------------|------------------------------------------------------------------------------------------------------------------------------|-----|----------------------|-----------------------------------------------------------------------------------------------------------------------|-------| | 1.1 | Scope ................................................................... | 1 | 2.7 | SAE International ............................................... | 7 | | 1.2 | Purpose ................................................................ | 1 | 2.8 | Military Standards .............................................. | 7 | | 1.3 | Classification ....................................................... | 1 | 3 | MATERIALS, COMPONENTS AND EQUIPMENT | | | 1.4 | Measurement Units and Applications ................ | 1 | | REQUIREMENTS ...................................................... | 8 | | 1.4.1 | Verification of Dimensions ................................. | 1 | 3.1 | Materials ............................................................. | 8 | | 1.5 | Definition of Requirements ................................ | 1 | 3.2 | Solder .................................................................. | 8 | | 1.5.1 | Hardware Defects and Process Indicators ......... | 2 | 3.2.1 | Solder - Lead Free ............................................. | 8 | | 1.5.2 | Material and Process Nonconformance ............. | 2 | 3.2.2 | Solder Purity Maintenance ................................. | 8 | | 1.6 | General Requirements ........................................ | 2 | 3.3 | Flux ..................................................................... | 9 | | 1.7 | Order of Precedence ........................................... | 3 | 3.3.1 | Flux Application ................................................. | 9 | | 1.7.1 | Conflict ................................................................ | 3 | 3.4 | Solder Paste ........................................................ | 9 | | 1.7.2 | Clause References .............................................. | 3 | 3.5 | Solder Preforms .................................................. | 9 | | 1.7.3 | Appendices .......................................................... | 3 | 3.6 | Adhesives ............................................................ | 9 | | 1.8 | Terms and Definitions ........................................ | 3 | 3.7 | Chemical Strippers ............................................. | 9 | | 1.8.1 | Diameter .............................................................. | 3 | 3.8 | Components ........................................................ | 9 | | 1.8.2 | Disposition .......................................................... | 3 | 3.8.1 | Component and Seal Damage ............................ | 9 | | 1.8.3 | Electrical Clearance ............................................ | 3 | 3.8.2 | Coating Meniscus ............................................. | 10 | | 1.8.4 | FOD (Foreign Object Debris) ............................ | 3 | 3.9 | Tools and Equipment ........................................ | 10 | | 1.8.5 | High Voltage ....................................................... | 3 | | GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS .................................................... | | | 1.8.6 1.8.7 | Manufacturer (Assembler) .................................. Objective Evidence ............................................. | 3 4 | 4 4.1 | Electrostatic Discharge (ESD) ......................... | 10 10 | | 1.8.8 | Process Control ................................................... | 4 | 4.2 | Facilities ............................................................ | 10 | | 1.8.9 | Proficiency .......................................................... | 4 | 4.2.1 | Environmental Controls .................................... | 10 | | 1.8.10 | Solder Destination Side ...................................... 4 | | 4.2.2 | Temperature and Humidity ............................... | 10 | | 1.8.11 | Source Side ............................................. | 4 | 4.2.3 | Lighting ............................................................. | 10 | | 1.8.12 | Solder Supplier ............................................................... | 4 | 4.2.4 | Field Assembly Operations .............................. | 10 | | 1.8.13 | User ..................................................................... | 4 | 4.3 | Solderability ...................................................... | 10 | | 1.8.14 | Wire Overwrap ................................................... | 4 | 4.4 | Solderability Maintenance ................................ | 10 | | 1.8.15 | | | 4.5 | | 11 | | | Wire Overlap ...................................................... | 4 | | Removal of Component Surface Finishes ....... | | | 1.9 | Requirements Flowdown .................................... | 4 | 4.5.1 | Gold Removal ................................................... | 11 | | | Acceptance Requirements .................................. | | 4.5.2 Other Metallic | Surface Finishes Removal ....... | 11 11 | | 1.11 1.12 | General Assembly Requirements ....................... | 5 5 | 4.6 | Thermal Protection ........................................... | | | 1.13 | Miscellaneous Requirements .............................. | 5 | 4.7 4.8 | Rework of Nonsolderable Parts ....................... Preprocessing Cleanliness Requirements ......... | 11 11 | | 1.13.1 | Health and Safety ............................................... | 5 | 4.9 | General Part Mounting Requirements ............. | 11 | | 1.13.2 | Procedures for Specialized Technologies .......... | 5 | 4.9.1 | | 12 | | 2 | APPLICABLE DOCUMENTS .................................... 6 | | 4.9.2 | General Requirements ...................................... Lead Deformation Limits ................................. | 12 | | 2.1 | IPC ...................................................................... | 6 | 4.10 | Hole Obstruction .............................................. | 12 | | 2.2 | JEDEC ................................................................ | 7 | 4.11 | Metal-Cased Component Isolation ................... | 12 | | 2.3 | Joint Industry Standards ..................................... | 7 | 4.12 | Adhesive Coverage Limits ............................... | 12 | | 2.4 | ASTM ................................................................. | 7 | 4.13 | Mounting of Parts on Parts (Stacking of | | | 2.5 | Electrostatic Discharge Association ................... | 7 | | Components) ..................................................... | 12 |

| 4.14 | Connectors and Contact Areas ......................... | 12 | 5.6.1 | Insulation .......................................................... | 23 | |------------------------------------------------|----------------------------------------------------------------------------------------------------------------------|------|-----------------------------------------------------------------------|-----------------------------------------------------------------------------------------------------|------------------| | 4.15 | Handling of Parts .............................................. | 12 | 5.6.2 | Wire Routing .................................................... | 23 | | 4.15.1 | Preheating ......................................................... | 12 | 5.6.3 | Wire Staking ..................................................... | 23 | | 4.15.2 | Controlled Cooling ........................................... | 12 | 5.6.4 | Unpopulated Land or Via - Lap Soldered ...... | 23 | | 4.15.3 | Drying/Degassing ............................................. | 12 | 5.6.5 | Supported Holes ............................................... | 23 | | 4.15.4 | Holding Devices and Materials ........................ | 12 | 5.6.6 | SMT .................................................................. | 23 | | 4.16 | Machine (Nonreflow) Soldering ...................... | 13 | THROUGH-HOLE MOUNTING AND | THROUGH-HOLE MOUNTING AND | | | 4.16.1 | Machine Controls ............................................. | 13 | 6 TERMINATIONS ...................................................... | 6 TERMINATIONS ...................................................... | 24 | | 4.16.2 | Solder Bath ....................................................... | 13 | 6.1 | Through-Hole Terminations - General ............ | 24 | | 4.17 | Reflow Soldering .............................................. | 13 | 6.1.1 | Lead Forming ................................................... | 25 | | 4.17.1 | Intrusive Soldering (Paste-in-Hole) ................. | 13 | 6.1.2 | Termination Requirements ............................... | 25 | | 4.18 | Solder Connection ............................................ | 13 | 6.1.3 | Lead Trimming ................................................. | 26 | | 4.18.1 | Exposed Surfaces .............................................. | 14 | 6.1.4 | Interfacial Connections ..................................... | 26 | | 4.18.2 | Solder Connection Anomalies .......................... | 14 | 6.1.5 | Coating Meniscus In Solder ............................. | 26 | | 4.18.3 | Partially Visible or Hidden Solder | | 6.2 | Supported Holes ............................................... | 27 | | | Connections ...................................................... | 14 | 6.2.1 | Solder Application ............................................ | 27 | | 4.19 | Heat Shrinkable Soldering Devices ................. | 14 | 6.2.2 | Through-Hole Component Lead Soldering ..... | 27 | | 5 WIRES AND TERMINAL CONNECTIONS ............. | 5 WIRES AND TERMINAL CONNECTIONS ............. | 15 | 6.3 Unsupported Holes ........................................... | 6.3 Unsupported Holes ........................................... | 27 | | 5.1 | Wire and Cable Preparation ............................. | 15 | 6.3.1 | Lead Termination Requirements for | | | 5.1.1 | Insulation Damage ............................................ | 15 | Unsupported Holes ........................................... | Unsupported Holes ........................................... | 27 | | 5.1.2 5.1.3 | Strand Damage ................................................. 15 Tinning of Stranded Wire - Forming .............. | 16 | 7 SURFACE 7.1 | MOUNTING OF COMPONENTS Surface Mount Device Lead ............................ | .......... 28 28 | | 5.2 | Solder Terminals ............................................... | 16 | 7.1.1 | Plastic Components .......................................... | 28 | | 5.3 | Bifurcated, Turret and Slotted Terminal | | 7.1.2 | Forming ............................................................. | 28 | | | Installation ........................................................ | 16 | 7.1.3 | Unintentional Bending ...................................... | 29 | | 5.3.1 | Shank Damage .................................................. | 16 | 7.1.4 | Flat Pack Parallelism ........................................ | 29 | | 5.3.2 | Flange Damage ................................................. | 16 | 7.1.5 | Surface Mount Device Lead Bends ................. | 29 | | 5.3.3 | Flared Flange Angles ........................................ | 16 | 7.1.6 | Flattened Leads ................................................. | 29 | | 5.3.4 | Terminal Mounting - Mechanical .................... | 17 | 7.1.7 | Parts Not Configured for Surface Mounting | ... 29 | | 5.3.5 | Terminal Mounting - Electrical ....................... | 17 | 7.2 | Leaded Component Body Clearance ............... | 29 | | 5.3.6 | Terminal Mounting - Soldering ....................... | 17 | 7.2.1 | Axial-Leaded Components ............................... | 29 | | 5.4 | Mounting to Terminals ..................................... | 17 | 7.3 | Parts Configured for Butt/I Lead Mounting | .... 29 | | 5.4.1 | General Requirements ...................................... | 17 | 7.4 | Installation of Surface Mount Components | ..... 29 | | 5.4.2 | Turret and Straight Pin Terminals .................... | 19 | 7.5 | Soldering Requirements ................................... | 29 | | 5.4.3 | Bifurcated Terminals ........................................ | 19 | 7.5.1 | Misaligned Components ................................... | 30 | | 5.4.4 | Slotted Terminals .............................................. | 21 | 7.5.2 | Unspecified and Special Requirements ............ | 30 | | 5.4.5 | Hook Terminals ................................................ | 21 | 7.5.3 | Bottom Only Chip Component Terminations ..................................................... | 31 | | 5.4.6 | Pierced or Perforated Terminals ....................... | 21 | 7.5.4 | Rectangular or Square End Chip | | | 5.4.7 | Cup and Hollow Cylindrical Terminals - Placement .......................................................... | 22 | | Components - 1, 2, 3 or 5 Side Termination(s) ................................................... | 32 | | 5.5 | Soldering to Terminals ..................................... | 22 | 7.5.5 | Cylindrical End Cap Terminations ................... | 33 | | 5.5.1 | Bifurcated Terminals ........................................ | 22 | 7.5.6 | Castellated Terminations .................................. | 34 | | 5.5.2 | Slotted Terminal ............................................... | 22 | 7.5.7 | Flat Gull Wing Leads ....................................... | 35 | | 5.5.3 | Cup and Hollow Cylindrical Terminals - Soldering ........................................................... | 22 | 7.5.8 | Round or Flattened (Coined) Gull Wing Leads ....................................................... | 36 | | 5.6 | Jumper Wires .................................................... | 22 | 7.5.9 | J Lead Terminations ......................................... | 37 |

| 7.5.10 | Butt/I Terminations ........................................... | 38 | 10.3.2 | Thickness .......................................................... | Thickness .......................................................... | 55 | |-------------------------------------------------------------------------------------------------------------|------------------------------------------------------------------------------------------------------------------------|---------------------------------|-----------------------|---------------------------------------------------------------------------------------------------------------------------|---------------------------------------------------------------------------------------------------------------------------|-------| | 7.5.11 | Flat Lug Leads and Flat Unformed Leads ...... | 40 | 10.3.3 | Uniformity ........................................................ | Uniformity ........................................................ | 55 | | 7.5.12 | Tall Profile Components Having Bottom Only Terminations ............................................ | | 10.3.4 | Transparency ..................................................... | Transparency ..................................................... | 55 | | 7.5.13 | Inward Formed L-Shaped Ribbon Leads ........ | 42 43 | 10.3.5 | Bubbles and Voids ............................................ | Bubbles and Voids ............................................ | 55 | | | Surface Mount Area Array Packages ............... | 44 | 10.3.6 | Delamination ..................................................... | Delamination ..................................................... | 55 | | 7.5.14 | | | 10.3.7 | Foreign Objects Debris .................................... | Foreign Objects Debris .................................... | 55 | | 7.5.15 | Bottom Termination Components (BTC) ........ | 47 | 10.3.8 | Other Visual Conditions ................................... | Other Visual Conditions ................................... | 55 | | 7.5.16 | Components with Bottom Thermal Plane | | 10.3.9 | Inspection .......................................................... | Inspection .......................................................... | 56 | | 7.5.17 | Terminations (D-Pak) ....................................... Flattened Post Connections .............................. | 48 49 | 10.3.10 | Rework or Touchup of Conformal Coating ..... | Rework or Touchup of Conformal Coating ..... | 56 | | 7.5.18 | P-Style Terminations ........................................ | 50 | 10.4 | Encapsulation .................................................... | Encapsulation .................................................... | 56 | | 7.6 | Specialized SMT Terminations ........................ | 50 | 10.4.1 | Application ........................................................ | Application ........................................................ | 56 | | 8 CLEANING PROCESS REQUIREMENTS ............. | 8 CLEANING PROCESS REQUIREMENTS ............. | 51 | 10.4.2 | Performance Requirements .............................. | Performance Requirements .............................. | 56 | | 8.1 | Cleanliness Exemptions .................................... | 51 | 10.4.3 | Rework of Encapsulant Material ..................... Encapsulant Inspection ..................................... | Rework of Encapsulant Material ..................... Encapsulant Inspection ..................................... | 56 56 | | 8.2 | Ultrasonic Cleaning .......................................... | 51 | 10.4.4 10.5 | | Staking .............................................................. | 56 | | 8.3 | Post-Solder Cleanliness .................................... | 51 | 10.5.1 | Staking - Application ....................................... | Staking - Application ....................................... | 56 | | | Foreign Object Debris (FOD) .......................... | 51 | | | | | | 8.3.1 8.3.2 | Flux Residues and Other Ionic or Organic Contaminants .................................................... | | 10.5.2 10.5.3 | Staking - Adhesive ........................................... | Staking (Inspection) .......................................... | 58 58 | | 8.3.3 | Post-Soldering Cleanliness Designator ............ | 51 51 | 11 | WITNESS (TORQUE/ANTI-TAMPERING) | WITNESS (TORQUE/ANTI-TAMPERING) | | | 8.3.4 | Cleaning Option ................................................ | 51 | | STRIPE .................................................................. | STRIPE .................................................................. | 58 | | 8.3.5 8.3.6 | Test for Cleanliness .......................................... | 51 52 | 12 PRODUCT | Inspection Methodology ................................... | Inspection Methodology ................................... | 58 58 | | 9 | Testing ............................................................... | | 12.1 12.1.1 | | | | | PCB REQUIREMENTS ........................................... | PCB REQUIREMENTS ........................................... | 53 | 12.1.2 | Process Verification Inspection ........................ Visual Inspection .............................................. | Process Verification Inspection ........................ Visual Inspection .............................................. | 58 59 | | 9.1 9.1.1 | Printed Circuit Board Damage Blistering/Delamination .................................... | ......................... 53 53 | 12.2 | Process Control Requirements ......................... | Process Control Requirements ......................... | 60 | | 9.1.2 | Weave Exposure/Cut Fibers ............................. | 53 | 12.2.1 | Opportunities Determination ............................ | Opportunities Determination ............................ | 60 | | 9.1.3 | | | | Statistical Process Control ................................ | Statistical Process Control ................................ | 60 | | | Haloing .............................................................. | 53 | 12.3 | REWORK AND REPAIR ....................................... | REWORK AND REPAIR ....................................... | | | 9.1.4 9.1.5 | Edge Delamination ........................................... Land/Conductor Separation .............................. | 53 53 | 13 | Rework .............................................................. | Rework .............................................................. | 61 61 | | 9.1.6 | Land/Conductor Reduction in Size .................. | 53 | 13.1 13.2 | Repair ................................................................ | Repair ................................................................ | 61 | | 9.1.7 | Flexible Circuitry Delamination ...................... | 53 | | | | | | 9.1.8 | Flexible Circuitry Damage ............................... | 53 | 13.3 | Post Rework/Repair Cleaning .......................... | Post Rework/Repair Cleaning .......................... | 61 | | 9.1.9 | Burns ................................................................. | 53 | APPENDIX A | APPENDIX A | Guidelines for Soldering Tools and Equipment ................................... | 62 | | 9.1.10 | Non-Soldered Edge Contacts ........................... | 53 | | | | | | 9.1.11 | Measles ............................................................. | 53 | APPENDIX B | APPENDIX B | Minimum Electrical Clearance - Electrical Conductor Spacing .......... | 64 | | 9.1.12 | Crazing .............................................................. | 54 | | | | | | 9.2 | Marking ............................................................. | 54 | APPENDIX C | APPENDIX C | J-STD-001 Guidance on Objective Evidence of | | | 9.3 | Bow and Twist (Warpage) ................................ | 54 | | | Material Compatibility ....................... | 66 | | 9.4 | Depanelization .................................................. | 54 | | | | | | 10 COATING, ENCAPSULATION AND STAKING (ADHESIVE) .......................................................... | 10 COATING, ENCAPSULATION AND STAKING (ADHESIVE) .......................................................... | 54 | Figure 1-1 | Figure 1-1 | Figures Overwrap ......................................................... | 4 | | 10.1 | Conformal Coating - Materials ....................... | 54 | Figure 1-2 | Figure 1-2 | Overlap ............................................................ | 4 | | 10.2 | Conformal Coating - Masking ........................ | 54 | Figure 4-1 | Figure 4-1 | Hole Obstruction ............................................ | 12 | | 10.3 | Conformal Coating - Application .................... 54 | 55 | Figure 4-2 Figure 5-1 | Figure 4-2 Figure 5-1 | Acceptable Wetting Angles ........................... | 13 | | 10.3.1 | Conformal Coating on Components ................ | | | | Insulation Thickness ...................................... | 15 |

| Figure 5-2 | Flange Damage ............................................. | 16 | Figure 10-1 | Radial Leaded Components whose height is greater than or equal to | | |---------------------------|-------------------------------------------------------------------------------------------------------------------------|-------|---------------------|-----------------------------------------------------------------------------------------------------------|---------------------------------| | Figure 5-3 | Flare Angles .................................................. | 16 | | their length or diameter - Individual | | | Figure 5-4 | Terminal Mounting - Mechanical .................. | 17 | | Rectangular Shaped Component .................. | 57 | | Figure 5-5 | Terminal Mounting - Electrical ...................... | 17 | Figure 10-2 | Radial Leaded Components whose height | | | Figure 5-6 | Insulation Clearance Measurement .............. | 17 | | is greater than or equal to their length or | | | Figure 5-7 | Service Loop for Lead Wiring ....................... | 18 | | diameter - Individual Cylindrically Shaped Component .................................................... | 57 | | Figure 5-8 | Cup and Hollow Cylindrical Terminal - Solder Height ................................................. | 18 | | | | | Figure 5-9 | Wires on Intermediate Turret Terminal .......... | 18 | | Tables | | | Figure 5-10 | Wire and Lead Placement ............................. | 19 | Table 1-1 | Design, Fabrication and Acceptability Specifications .................................................. | 3 | | Figure 5-11 | Bifurcated Terminal Side Route Placement with Wrap ...................................................... | 19 | Table 3-1 | Maximum Limits of Solder Bath Contaminant .................................................... | | | Figure 5-12 | Bifurcated Terminal Side Route Placement - Straight Though and Staked ......................... | 20 | Table 4-1 | Solder Anomalies .......................................... | 8 14 | | Figure 5-13 | Bifurcated Terminal Top and Bottom Route Connection .................................................... | 20 | Table 5-1 Table 5-2 | Allowable Strand Damage ............................. Terminal Mounting Minimum Soldering | 15 | | Figure 5-14 | Slotted Terminal ............................................. | 21 | | Requirements ................................................ | 17 | | Figure 5-15 | Hook Terminal Wire Placement ..................... | 21 | Table 5-3 | Turret and Straight Pin Wire Placement ....... | 19 | | Figure 5-16 | Acceptable Pierced or Perforated Terminal Wire Placement ............................................. | 22 | Table 5-4 | AWG 30 and Smaller Wire Wrap Requirements ................................................ | 19 | | Figure 5-17 | Solder Depression ......................................... | 22 | Table 5-5 | Bifurcated Terminal Wire Placement - Side Route with Wrap ................................... | 20 | | Figure 5-18 | Cup and Hollow Cylindrical Terminals - Vertical Fill of Solder ..................................... | 22 | Table 5-6 | Bifurcated Terminal Side Route Straight-Through Staking Requirements | 20 | | Figure 6-1 | Component Lead Stress Relief Examples .... | 24 | | | ....... | | Figure 6-2 | Lead Bends ................................................... | 25 | Table 5-7 | Bifurcated Terminal Wire Placement - Bottom Route ................................................ | 20 | | Figure 6-3 | Lead Trimming ............................................... | 26 26 | Table 5-8 | Hook Terminal Wire Placement ..................... | 21 | | Figure 6-4 Figure 7-1 | Vertical Fill Example ...................................... Surface Mount Device Lead Forming ........... | 28 | Table 5-9 | Pierced or Perforated Terminal Wire Placement ...................................................... | 21 | | Figure 7-2 | Surface Mount Device Lead Forming ........... | 28 | Table 5-10 | Solder Requirements Lead/Wire to Post ...... | 22 | | | | | Table 6-1 | Component to Land Clearance ..................... | 24 | | Figure 7-3 | Bottom Only Terminations ............................. | 31 | Table 6-2 | Components with Spacers ............................ | 24 | | Figure 7-4 | Rectangular or Square End Chip Components .................................................. | 32 | Table 6-3 | Lead Bend Radius ......................................... | 25 | | Figure 7-5 | Cylindrical End Cap Terminations ................. | 33 | Table 6-4 | Protrusion of Leads in Supported Holes | ....... 25 | | Figure 7-6 | Castellated Terminations ............................... | 34 | Table 6-5 | Protrusion of Leads in Unsupported Holes | ... 25 | | Figure 7-7 | Flat Gull Wing Leads ..................................... | 35 | Table 6-6 | Supported Holes with Component Leads, Minimum Acceptable Conditions ................... | 26 | | Figure 7-8 | Round or Flattened (Coined) Gull Wing Leads ................................................... | 36 | Table 6-7 | Unsupported Holes with Component Leads, Minimum Acceptable Conditions ................... | 27 | | Figure 7-9 Figure 7-10 | J Leads .......................................................... Terminations for Modified | 37 | Table 7-1 | SMT Lead Forming Minimum Lead | | | | Butt/I Through-Hole Leads ...................................... | 38 | Table 7-2 | Length (L) ...................................................... Surface Mount Components | 28 ......................... 30 | | Figure 7-11 | Butt/I Terminations for Solder Charged Leads .............................................. | 39 41 | Table 7-3 | Dimensional Criteria - Bottom Only Chip Component Terminations .............................. | | | Figure 7-12A Figure 7-12B | Flat Lug Leads .............................................. Flat Unformed Leads ..................................... | 41 | Table 7-4 | Dimensional Criteria - Rectangular or Square End Chip Components - | 31 | | Figure 7-13 | Tall Profile Components Having Bottom | 42 | | 1, 2, 3 or 5 Side Termination(s) .................... | 32 | | Figure 7-14 | Only Terminations .......................................... Inward Formed L-Shaped Ribbon Lead ........ | 43 | Table 7-5 | Dimensional Criteria - Cylindrical End Cap Terminations .......................................... | 33 | | Figure 7-15 | BGA Solder Ball Clearance ........................... | 45 | Table 7-6 | Dimensional Criteria - Castellated | | | Figure 7-16 | Bottom Termination Component .................... | 47 | | Terminations .................................................. | 34 | | Figure 7-17 | Bottom Thermal Plane Termination ............... | 48 | Table 7-7 | Dimensional Criteria - Flat Gull Wing Leads ............................................................. | 35 | | Figure 7-18 Figure 7-19 | Flattened Post Termination ........................... P-Style Termination ....................................... | 49 50 | Table 7-8 | Dimensional Criteria - Round or Flattened (Coined) Gull Wing Leads ............................. | 36 |

| Table 7-9 | Dimensional Criteria - J Leads ..................... | 37 | |-------------|-----------------------------------------------------------------------------------------------------------------------------------|------| | Table 7-10 | Dimensional Criteria - Butt/I Connections .... | 38 | | Table 7-11 | Dimensional Criteria - Butt/I Terminations - Solder Charged Terminations ........................ | 39 | | Table 7-12A | Dimensional Criteria - Power Dissipating Flat Lug Leads .............................................. | 40 | | Table 7-12B | Dimensional Criteria - Flat Unformed Leads, e.g., flexible circuitry termination ....... | 40 | | Table 7-13 | Dimensional Criteria - Tall Profile Components Having Bottom Only Terminations .................................................. | 42 | | Table 7-14 | Dimensional Criteria - Inward Formed L-Shaped Ribbon Leads ............................... | 43 | | Table 7-15 | Dimensional Criteria - Ball Grid Array Components with Collapsing Balls ................ | 45 | | Table 7-16 | Ball Grid Array Components with Noncollapsing Balls ....................................... | 46 |

Table 7-17

Table 7-18

Table 7-19

Table 7-20

Table 7-21

Table 8-1

Table 8-2

Table 10-1

Table 12-1

Table 12-2

Table 12-3

Column Grid Array ......................................... 46

Dimensional Criteria - BTC

.......................... 47

Dimensional Criteria - Bottom Thermal

Plane Terminations ........................................ 48

Dimensional Criteria Flattened Post

Connections ................................................... 49

Dimensional Criteria - P-Style

Terminations

.................................................. 50

Designation of Surfaces to be Cleaned

........ 51

Cleanliness Testing Designators

................... 51

Coating Thickness ......................................... 55

Magnification Aid Applications for Solder

Connections ................................................... 59

Magnification Aid Applications for Wires and Wire Connections ................................... 59

Magnification Aid Applications - Other

......... 59

1 GENERAL

1.1 Scope This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this Standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.

1.2 Purpose This Standard prescribes material requirements, process requirements, and acceptability requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPCAJ-820 and IPC-A-610. Standards may be updated at any time, including with the addition of amendments. The use of an amendment or a newer revision is not automatically required.

1.3 Classification This Standard recognizes that electrical and electronic assemblies are subject to classifications by intended end-item use. Three general end-product classes have been established to reflect differences in manufacturability, complexity, functional performance requirements, and verification (inspection/test) frequency. It should be recognized that there may be overlaps of equipment between classes.

The User, see 1.8.13, is responsible for defining the product class. The product class should be stated in the procurement documentation package.

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures.

CLASS 3 High Performance/Harsh Environment Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems.

1.4 Measurement Units and Applications This Standard uses International System of Units (SI) units per ASTM SI10, IEEE/ASTM SI 10, Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this Standard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g) [oz] for weight, and lumens (lm) [footcandles] for illuminance.

Note: This Standard uses other SI prefixes (ASTM SI10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm becomes 1.2 µm) or as alternative to powers-of-ten (3.6 x 10 3 mm becomes 3.6 m).

1.4.1 Verification of Dimensions Actual measurement of specific part mounting and solder fillet dimensions and determination of percentages are not required except for referee purposes. For determining conformance to the specifications in this Standard, round all observed or calculated values 'to the nearest unit' in the last right-hand digit used in expressing the specification limit, in accordance with the rounding method of ASTM Practice E29. For example, specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round the measured value to the nearest 0.1 mm, 0.01 mm, or 0.001 mm, respectively, and then compare to the specification number cited.

1.5 Definition of Requirements The words shall or shall not are used in the text of this document wherever there is a requirement for materials, preparation, process control or acceptance of a soldered connection.

Requirements for Soldered Electrical and Electronic Assemblies