Supersedes:

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Supersedes:

IPC-A-610F WAM1 February 2016 IPC-A-610F - July 2014 IPC-A-610E - April 2010 IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983

IPC-A-610G

Acceptability of Electronic Assemblies

Developed by the IPC-A-610 Task Group (7-31b) of the Acceptability Subcommittee (7-31) of the Product Assurance Committee (7-30) of IPC

Users of this publication are encouraged to participate in the development of future revisions.

Contact:

IPC

Table of Contents

| 1 General ...................................................................... | 1 General ...................................................................... | 1-1 | |------------------------------------------------------------------------------------|------------------------------------------------------------------------------------|-------| | 1.1 Scope ...................................................................... | 1.1 Scope ...................................................................... | 1-2 | | 1.2 Purpose ................................................................... | 1.2 Purpose ................................................................... | 1-3 | | 1.3 Classification ......................................................... | 1.3 Classification ......................................................... | 1-3 | | 1.4 Measurement Units and Applications | ................. | 1-3 | | 1.4.1 Verification of Dimensions ...................................... | 1.4.1 Verification of Dimensions ...................................... | 1-3 | | 1.5 Definition of Requirements .................................. | 1.5 Definition of Requirements .................................. | 1-3 | | 1.5.1 | Acceptance Criteria .......................................... | 1-4 | | 1.5.1.1 | Target Condition .............................................. | 1-4 | | 1.5.1.2 | Acceptable Condition ....................................... | 1-4 | | 1.5.1.3 | Defect Condition .............................................. | 1-4 | | 1.5.1.3.1 | Disposition ....................................................... | 1-4 | | 1.5.1.4 | Process Indicator Condition ............................. | 1-4 | | 1.5.1.5 | Combined Conditions ...................................... | 1-4 | | 1.5.1.6 | Conditions Not Specified ................................. | 1-4 | | 1.5.1.7 | Specialized Designs ......................................... | 1-5 | | 1.6 Process Control Methodologies ........................... | 1.6 Process Control Methodologies ........................... | 1-5 | | 1.7 Order of Precedence ............................................. | 1.7 Order of Precedence ............................................. | 1-5 | | 1.7.1 | Clause References ........................................... | 1-5 | | 1.7.2 | Appendices ...................................................... | 1-5 | | 1.8 Terms and Definitions ........................................... | 1.8 Terms and Definitions ........................................... | 1-5 | | 1.8.1 | Board Orientation ............................................. | 1-5 | | 1.8.1.1 | *Primary Side .................................................... | 1-5 | | 1.8.1.2 | *Secondary Side ............................................... | 1-5 | | 1.8.1.3 | Solder Source Side .......................................... | 1-5 | | 1.8.1.4 | Solder Destination Side .................................... | 1-5 | | 1.8.2 | *Cold Solder Connection ................................... | 1-6 | | 1.8.3 | Diameter .......................................................... | 1-6 | | 1.8.4 | Electrical Clearance .......................................... | 1-6 | | 1.8.5 | FOD (Foreign Object Debris) ............................ | 1-6 | | 1.8.6 | High Voltage .................................................... | 1-6 | | 1.8.7 | Intrusive Solder ................................................ | 1-6 | | 1.8.8 | Locking Mechanism ......................................... | 1-6 | | 1.8.9 | Meniscus (Component) .................................... | 1-6 | | 1.8.10 | *Nonfunctional Land .......................................... | 1-6 | | 1.8.11 | Pin-in-Paste ..................................................... | 1-6 | | 1.8.12 | Solder Balls ...................................................... | 1-6 | | 1.8.13 | *Stress Relief ..................................................... | 1-6 | | 1.8.14 | Wire Overlap .................................................... | 1-6 | | 1.8.15 | Wire Overwrap ................................................. | 1-6 | | 1.9 Requirements Flowdown ...................................... | 1.9 Requirements Flowdown ...................................... | 1-6 | | 1.10 Personnel Proficiency ......................................... | 1.10 Personnel Proficiency ......................................... | 1-7 |

1.11

Acceptance Requirements

1.12

................................. 1-7

Inspection Methodology

1.12.1

Lighting

..................................... 1-7

............................................................ 1-7

1.12.2

Magnification Aids ............................................ 1-7

2 Applicable Documents

2.1

............................................. 2-1

IPC Documents

...................................................... 2-1

2.2

Joint Industry Documents

.................................... 2-1

2.3

Electrostatic Association Documents

2.4 JEDEC

................. 2-2

..................................................................... 2-2

2.5

International Electrotechnical Commission

Documents

............................................................. 2-2

2.6 ASTM

2.7

...................................................................... 2-2

Military Standards

................................................. 2-2

3 Handling Electronic Assemblies

3.1

............................. 3-1

EOS/ESD Prevention

3.1.1

............................................. 3-2

Electrical Overstress (EOS)

3.1.2

3.1.3

3.1.4

.................................. 3-3

Electrostatic Discharge (ESD)

.............................. 3-4

Warning Labels .................................................... 3-5

Protective Materials

............................................. 3-6

3.2

EOS/ESD Safe Workstation/EPA

3.3

.......................... 3-7

Handling Considerations

3.3.1

...................................... 3-9

Guidelines ............................................................ 3-9

3.3.2

3.3.3

3.3.4

3.3.5

Physical Damage ............................................... 3-10

Contamination

................................................... 3-10

Electronic Assemblies ........................................ 3-11

After Soldering ................................................... 3-11

3.3.6

Gloves and Finger Cots ..................................... 3-12

4 Hardware

................................................................... 4-1

4.1

Hardware Installation

4.1.1

............................................ 4-2

Electrical Clearance ........................................... 4-2

4.1.2

4.1.3

4.1.4

4.1.4.1

4.1.4.2

4.1.5

4.1.5.1

4.1.5.2

Interference

....................................................... 4-3

Component Mounting - High Power ................. 4-4

Heatsinks

.......................................................... 4-6

Insulators and Thermal Compounds

................. 4-6

Contact ............................................................. 4-8

Threaded Fasteners and Other

Threaded Hardware

.......................................... 4-9

Torque

............................................................ 4-11

Wires ............................................................... 4-13

4.2

Jackpost Mounting

4.3

Connector Pins

4.3.1

4.3.2

4.3.2.1

Table of Contents (cont.)

.............................................. 4-15

.................................................... 4-16

Edge Connector Pins ...................................... 4-16

Press Fit Pins

.................................................. 4-17

Soldering ......................................................... 4-20

4.4

Wire Bundle Securing

4.4.1

......................................... 4-23

General

4.4.2

4.4.2.1

Lacing

........................................................... 4-23

............................................................. 4-26

Damage .......................................................... 4-27

4.5

Routing - Wires and Wire Bundles

4.5.1

Wire Crossover

4.5.2

4.5.3

4.5.4

Bend Radius

.................... 4-28

............................................... 4-28

................................................... 4-29

Coaxial Cable .................................................. 4-30

Unused Wire Termination ................................ 4-31

4.5.5

Ties over Splices and Ferrules

5 Soldering

........................ 4-32

................................................................... 5-1

5.1

Soldering Acceptability Requirements

5.2

Soldering Anomalies

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.7.1

5.2.7.2

5.2.7.3

5.2.8

5.2.9

5.2.10

5.2.11

5.2.12

5.2.13

5.2.14

................ 5-3

............................................. 5-4

Exposed Basis Metal ......................................... 5-4

Pin Holes/Blow Holes ........................................ 5-6

Reflow of Solder Paste ...................................... 5-7

Nonwetting ........................................................ 5-8

Cold/Rosin Connection

..................................... 5-9

Dewetting .......................................................... 5-9

Excess Solder

................................................. 5-10

Solder Balls ..................................................... 5-11

Bridging ........................................................... 5-12

Solder Webbing/Splashes ............................... 5-13

Disturbed Solder

............................................. 5-14

Fractured Solder

............................................. 5-15

Solder Projections

........................................... 5-16

Lead-Free Fillet Lift .......................................... 5-17

Lead-Free Hot Tear/Shrink Hole

..................... 5-18

Probe Marks and Other Similar Surface

Conditions in Solder Joints

............................. 5-19

Partially Visible or Hidden Solder

Connections .................................................... 5-20

6 Terminal Connections

.............................................. 6-1

6.1

Swaged Hardware

6.1.1

6.1.1.1

6.1.1.2

6.1.1.3

................................................. 6-3

Terminals ........................................................... 6-3

Terminal Base to Land Separation

Turret

.................... 6-3

................................................................ 6-5

Bifurcated .......................................................... 6-6

| 6.1.2 | Rolled Flange .................................................... | 6-7 | |--------------------------------------------------------------------------------------------------------------------------------------------------------|--------------------------------------------------------------------------------------------------------------------------------------------------------|-----------| | 6.1.3 | Flared Flange .................................................... | 6-8 | | 6.1.4 | Controlled Split .................................................. | 6-9 | | 6.1.5 | Solder ............................................................. | 6-10 | | 6.2 | Insulation .............................................................. | 6-12 | | 6.2.1 | Damage .......................................................... | 6-12 | | 6.2.1.1 | Presolder ......................................................... | 6-12 | | 6.2.1.2 | Post-Solder ..................................................... | 6-14 | | 6.2.2 | Clearance ........................................................ | 6-15 | | 6.2.3 | Insulation ......................................................... | 6-17 | | 6.2.3.1 | Placement ....................................................... | 6-17 | | 6.2.3.2 | Damage .......................................................... | 6-19 | | ............................................................ | ............................................................ | | | 6.3 Conductor | 6.3 Conductor | 6-20 | | 6.3.1 | Deformation .................................................... | 6-20 | | 6.3.2 | Damage .......................................................... | 6-21 | | 6.3.2.1 | Stranded Wire ................................................. | 6-21 | | 6.3.2.2 | Solid Wire ........................................................ | 6-22 | | 6.3.3 | Strand Separation (Birdcaging) - | | | | Presolder ......................................................... | 6-22 | | 6.3.4 | Strand Separation (Birdcaging) - | | | | Post-Solder ..................................................... | 6-23 | | 6.3.5 | Tinning ............................................................ | 6-24 | | 6.4 | Service Loops ...................................................... | 6-26 | | 6.5 Stress Relief | ........................................................ | 6-27 | | 6.5.1 | Bundle ............................................................. | 6-27 | | 6.5.2 | Lead/Wire Bend .............................................. | 6-28 | | 6.6 | Lead/Wire Placement - General | | | | Requirements ...................................................... | 6-30 | | 6.7 Solder - General Requirements 6.8 Turrets and Straight Pins ................................... | 6.7 Solder - General Requirements 6.8 Turrets and Straight Pins ................................... | | | 6.8.1 | Lead/Wire Placement ...................................... | 6-33 6-33 | | | | 6-35 | | 6.8.2 Solder ............................................................. 6.9 Bifurcated ............................................................ | 6.8.2 Solder ............................................................. 6.9 Bifurcated ............................................................ | 6-36 | | 6.9.1 | Lead/Wire Placement - Side Route | | | | Attachments .................................................... | 6-36 | | 6.9.2 | Lead/Wire Placement - Staked Wires ............. | 6-39 | | 6.9.3 | Lead/Wire Placement - Bottom and Top | | | 6.9.4 | Route Attachments ......................................... Solder ............................................................. | 6-40 6-41 | | 6.10 Slotted | ................................................................ | 6-44 | | | ...................................... | 6-44 | | 6.10.1 Lead/Wire Placement ............................................................. | 6.10.1 Lead/Wire Placement ............................................................. | | | 6.10.2 | | | | | Solder | 6-45 |

Table of Contents (cont.)

| 6.11 Pierced/Perforated ............................................ | 6.11 Pierced/Perforated ............................................ | 6-46 | |--------------------------------------------------------------------------------|---------------------------------------------------------------------------------------------------------------------|------------------------------------------| | 6.11.1 | Lead/Wire Placement ...................................... | 6-46 | | 6.11.2 | Solder ............................................................. | 6-48 | | 6.12 Hook .................................................................... | 6.12 Hook .................................................................... | 6-49 | | 6.12.1 | Lead/Wire Placement ...................................... | 6-49 | | 6.12.2 | Solder ............................................................. | 6-51 | | 6.13 Solder Cups ....................................................... | 6.13 Solder Cups ....................................................... | 6-52 | | 6.13.1 | Lead/Wire Placement ...................................... | 6-52 | | 6.13.2 | Solder ............................................................. | 6-54 | | 6.14 | AWG 30 and Smaller Diameter Wires - Lead/Wire Placement ....................................... | 6-56 | | 6.15 | Series Connected .............................................. | 6-57 | | 6.16 | Edge Clip - Position .......................................... | 6-58 | | 7 Through-Hole Technology ....................................... | 7 Through-Hole Technology ....................................... | 7-1 | | 7.1 Component Mounting ........................................... | 7.1 Component Mounting ........................................... | 7-2 | | 7.1.1 Orientation ....................................................... | 7.1.1 Orientation ....................................................... | | | | | 7-2 | | 7.1.1.1 | Orientation - Horizontal | .................................... 7-3 | | 7.1.1.2 | Orientation - Vertical ........................................ ................................................... | 7-5 7-6 | | 7.1.2 7.1.2.1 | Lead Forming Bend Radius .................................................... | 7-6 | | 7.1.2.2 | Space between Seal/Weld and Bend | .............. 7-7 | | 7.1.2.3 | Stress Relief ..................................................... | 7-8 | | 7.1.2.4 | Damage ......................................................... | 7-10 | | 7.1.3 | Leads Crossing Conductors .......................... | 7-11 | | 7.1.4 | Hole Obstruction ............................................ | 7-12 | | 7.1.5 | DIP/SIP Devices and Sockets ........................ | 7-13 | | 7.1.6 | Radial Leads - Vertical ................................... | 7-15 | | 7.1.6.1 | Spacers ......................................................... | 7-16 | | 7.1.7 | Radial Leads - Horizontal .............................. | 7-18 | | 7.1.8 | Connectors .................................................... | 7-19 | | 7.1.8.1 | Right Angle .................................................... | 7-21 | | 7.1.8.2 | Vertical Shrouded Pin Headers and Vertical Receptacle Connectors ................................. | 7-22 | | 7.1.9 | Conductive Cases .......................................... | 7-23 | | 7.2 Component Securing | .......................................... | 7-23 | | 7.2.1 | Mounting Clips ............................................... | 7-23 | | 7.2.2 | Adhesive Bonding .......................................... | 7-25 | | 7.2.2.1 | Adhesive Bonding - Nonelevated Components .................................................. | 7-26 | | 7.2.2.2 | Adhesive Bonding - Elevated Components .................................................. | 7-29 | | 7.2.3 | Other Devices ................................................ | 7-30 |

7.3

Supported Holes

7.3.1

7.3.2

7.3.3

7.3.4

7.3.5

7.3.5.1

7.3.5.2

7.3.5.3

7.3.5.4

7.3.5.5

7.3.5.6

7.3.5.7

7.3.5.8

7.3.5.9

7.3.5.10

7.3.5.11

7.3.5.12

7.4

.................................................. 7-31

Axial Leaded - Horizontal

.............................. 7-31

Axial Leaded - Vertical ................................... 7-33

Wire/Lead Protrusion

..................................... 7-35

Wire/Lead Clinches ........................................ 7-36

Solder

............................................................ 7-38

Vertical Fill (A)

................................................. 7-41

Solder Destination Side - Lead to

Barrel (B)

........................................................ 7-43

Solder Destination Side - Land Area

Coverage (C) .................................................. 7-45

Solder Source Side - Lead to Barrel (D)

Solder Source Side - Land Area

Coverage (E)

.................................................. 7-47

Solder Conditions - Solder in Lead Bend

...... 7-48

Solder Conditions - Touching Through-Hole

Component Body

.......................................... 7-49

Solder Conditions - Meniscus in Solder

........ 7-50

Lead Cutting after Soldering

.......................... 7-52

Coated Wire Insulation in Solder .................... 7-53

Interfacial Connection without Lead - Vias

Board in Board

.... 7-54

.............................................. 7-55

Unsupported Holes

7.4.1

7.4.2

7.4.3

7.4.4

7.4.5

7.4.6

.............................................. 7-58

Axial Leads - Horizontal ................................. 7-58

Axial Leads - Vertical

..................................... 7-59

Wire/Lead Protrusion

..................................... 7-60

Wire/Lead Clinches ........................................ 7-61

Solder

............................................................ 7-63

Lead Cutting after Soldering

7.5

.......................... 7-65

Jumper Wires

7.5.1

7.5.2

7.5.3

7.5.4

7.5.4.1

7.5.5

7.5.6

....................................................... 7-66

Wire Selection ................................................ 7-66

Wire Routing

.................................................. 7-67

Wire Staking

.................................................. 7-69

Supported Holes ............................................ 7-71

Supported Holes - Lead in Hole .................... 7-71

Wrapped Attachment ..................................... 7-72

Lap Soldered

................................................. 7-73

8

Surface Mount Assemblies

8.1

.................................... 8-1

Staking Adhesive

8.1.1

8.1.2

8.2

................................................... 8-3

Component Bonding ......................................... 8-3

Mechanical Strength

......................................... 8-4

SMT Leads

8.2.1

................................................................. 8-6

Plastic Components .......................................... 8-6

8.2.2

8.2.3

Damage ............................................................ 8-6

Flattening

.......................................................... 8-7

........ 7-46

Table of Contents (cont.)

| 8.3 SMT Connections .................................................. 8-7 | 8.3.4.6 | Minimum Fillet Height (F) ............................. | 8-46 | |-------------------------------------------------------------------------------------------------------------------------------------------------|----------------------------------------------------------------------------------------------------------|---------------------------------------------------------------------------------------------------------------------|-------------------------------------------------------------------------| | | 8.3.4.7 | Solder Thickness (G) ................................... | 8-46 | | 8.3.1 Chip Components - Bottom Only | 8.3.1 Chip Components - Bottom Only | 8.3.1 Chip Components - Bottom Only | | | Terminations ....................................................... 8-8 | Flat Gull Wing Leads ........................................ 8-47 | Flat Gull Wing Leads ........................................ 8-47 | Flat Gull Wing Leads ........................................ 8-47 | | 8.3.1.1 Side Overhang (A) ............................................ 8-9 | 8.3.5 8.3.5.1 | Side Overhang (A) ....................................... | 8-47 | | 8.3.1.2 End Overhang (B) .......................................... 8-10 | 8.3.5.2 | Toe Overhang (B) ........................................ | 8-51 | | | ........................................ 8-11 ..................................... 8-12 8.3.5.3 8.3.5.4 | Minimum End Joint Width (C) ...................... Minimum Side Joint Length (D) .................... | 8-52 | | | 8-13 8.3.5.5 | Maximum Heel Fillet Height (E) .................... | 8-54 8-56 | | 8.3.1.5 Maximum Fillet Height (E) ............................... | ................................ 8-13 8.3.5.6 | Minimum Heel Fillet Height (F) ..................... | 8-57 | | 8.3.1.7 Solder Thickness (G) ...................................... 8-14 | 8.3.1.7 Solder Thickness (G) ...................................... 8-14 | Solder Thickness (G) ................................... | 8-58 | | 8.3.1.8 End Overlap (J) .............................................. 8-14 | 8.3.5.7 8.3.5.8 | Coplanarity .................................................. | 8-59 | | 8.3.2 Rectangular or Square End Chip | 8.3.6 Round or Flattened (Coined) Gull | 8.3.6 Round or Flattened (Coined) Gull | 8.3.6 Round or Flattened (Coined) Gull | | Components - 1, 2, 3 or 5 Side | Components - 1, 2, 3 or 5 Side | Components - 1, 2, 3 or 5 Side | | | | Wing Leads ....................................................... 8-60 | Wing Leads ....................................................... 8-60 | Wing Leads ....................................................... 8-60 | | | 8-15 8.3.6.1 | Side Overhang (A) ....................................... | 8-61 | | Termination(s) ................................................... | ....................................... 8-16 8.3.6.2 | Toe Overhang (B) ........................................ | 8-62 | | 8.3.2.2 End Overhang (B) ........................................ 8.3.2.3 End Joint Width (C) ..................................... | 8-18 8.3.6.3 | Minimum End Joint Width (C) ...................... | 8-62 | | | 8-19 | | 8-63 | | | 8.3.6.4 8.3.6.5 | Minimum Side Joint Length (D) .................... | 8-64 | | 8.3.2.4 Side Joint Length (D) ................................... 8-21 | ............................ 8-22 8.3.6.6 | Maximum Heel Fillet Height (E) | .................... 8-65 | | | ............................. 8-23 ................................... 8-24 8.3.6.7 | Minimum Heel Fillet Height (F) ..................... Solder Thickness (G) ................................... | 8-66 | | | 8.3.6.8 | Minimum Side Joint Height (Q) | .................... 8-66 | | 8.3.2.8 End Overlap (J) ............................................ 8-25 8.3.2.9 Termination Variations ................................. 8-26 | 8.3.6.9 | Coplanarity .................................................. | 8-67 | | 8.3.2.9.1 Mounting on Side (Billboarding) ................... | J .............................................................. | J .............................................................. | J .............................................................. | | | 8-26 8.3.7 | Leads | 8-68 | | 8.3.2.9.2 Mounting Upside Down ............................... | 8-28 8.3.7.1 8.3.7.2 | Side Overhang (A) ....................................... | 8-68 | | 8.3.2.9.3 Stacking ...................................................... | 8-29 | Toe Overhang (B) ........................................ | 8-70 | | | 8.3.7.3 | | 8-70 | | 8.3.2.9.4 Tombstoning ............................................... 8-30 | .................................... 8-31 8.3.7.4 | End Joint Width (C) ..................................... Side Joint Length (D) ................................... | 8-72 | | | ................ 8-31 8.3.7.5 | | | | 8.3.2.10.1 Solder Width | 8.3.2.10.1 Solder Width | Maximum Heel Fillet Height (E) .................... | 8-73 | | 8.3.2.10.2 Minimum | ... 8.3.7.6 | 8.3.2.10.2 Minimum | 8-74 | | | 8-32 | Minimum Heel Fillet Height (F) ..................... Solder Thickness (G) ................................... | 8-76 | | | 8.3.7.7 | | 8-76 | | | .................. 8-33 8.3.7.8 | Coplanarity .................................................. | | | 8.3.3.1 Side Overhang (A) ....................................... | 8-35 8.3.8 | Butt/I Connections ........................................... | 8-77 | | 8.3.3.2 End Overhang (B) ........................................ | ..................................... 8-36 ................................... 8-37 8.3.8.1 8.3.8.1.1 | Modified Through-Hole Terminations Maximum Side Overhang (A) ....................... | ........... 8-77 8-78 | | 8.3.3.5 Maximum Fillet Height (E) ............................ 8-38 8.3.3.6 Minimum Fillet Height (F) ............................. | 8.3.8.1.2 | Toe Overhang (B) ........................................ | 8-78 | | 8.3.3.7 Solder Thickness (G) ................................... 8.3.3.8 End Overlap (J) ............................................ | 8.3.8.1.3 | Minimum End Joint Width (C) ...................... | 8-79 | | 8-39 8-40 8-41 | 8.3.8.1.4 | Minimum Side Joint Length (D) .................... | 8-79 | | | 8.3.8.1.5 8.3.8.1.6 | Maximum Fillet Height (E) ............................ | 8-79 | | | | Minimum Fillet Height (F) ............................. | 8-80 8-80 | | 8.3.4 Castellated Terminations ................................ | 8-42 8.3.8.1.7 | Solder Thickness (G) | | | | ....................................... 8-43 8.3.8.2 | ................................... Solder Charged Terminations | ...................... 8-81 | | 8.3.4.2 End Overhang (B) ........................................ 8.3.4.3 Minimum End Joint Width (C) ...................... | 8-44 8-44 8.3.8.2.1 8.3.8.2.2 | Maximum Side Overhang (A) ....................... Maximum Toe Overhang (B) | 8-82 ........................ 8-82 | | 8.3.4.4 Minimum Side Joint Length (D) .................... 8.3.4.5 Maximum Fillet Height (E) ............................ | 8-45 8.3.8.2.3 | Minimum End Joint Width (C) ...................... | 8-83 | | | 8-45 | Minimum Fillet Height (F) ............................. | | | | | | 8-83 | | | 8.3.8.2.4 | | |

Table of Contents (cont.)

| 8.3.9 Flat Lug Leads and Flat Unformed Leads | ...... 8-84 | |----------------------------------------------------------------------------------------------------------------------------------------------------------------|--------------------------------------------------------------------------------------------------| | 8.3.10 Tall Profile Components Having Bottom Only Terminations .......................................... | 8-86 | | 8.3.11 Inward Formed L-Shaped Ribbon Leads | ..... 8-87 | | 8.3.12 Surface Mount Area Array ............................ | 8-89 | | 8.3.12.1 Alignment | .................................................... 8-90 | | 8.3.12.2 Solder Ball Spacing | ..................................... 8-90 | | 8.3.12.3 Solder Connections ..................................... | 8-91 | | 8.3.12.4 Voids | ........................................................... 8-93 | | 8.3.12.5 Underfill/Staking | ........................................... 8-93 | | 8.3.12.6 Package on Package .................................. | 8-94 | | 8.3.13 Bottom Termination Components (BTC) ................................................................ | 8-96 | | 8.3.14 Components with Bottom Thermal Plane Terminations ........................................ | 8-98 | | 8.3.15 Flattened Post Connections | 8-100 | | 8.3.15.1 Maximum Termination Overhang - | 8.3.15.1 Maximum Termination Overhang - | | 8.3.15.2 Maximum Termination Overhang - Round Solder Land ...................................... | 8.3.15.2 Maximum Termination Overhang - Round Solder Land ...................................... | | 8.3.15.3 Maximum Fillet Height | 8-101 | | 8.3.16 P-Style Connections | 8-102 | | 8.3.16.1 Maximum Side Overhang (A) | 8-103 | | 8.3.16.2 Maximum Toe Overhang (B) | 8-103 | | | 8-104 | | 8.3.16.4 Minimum Side Joint Length (D) | 8-104 | | | 8-105 | | Specialized SMT Terminations ........................ | 8-106 | | Surface Mount Connectors .............................. | 8-107 | | 8.6 Jumper Wires ..................................................... | 8-108 | | 8.6.1 SMT | 8-109 | | ............................................................. 8.6.1.1 Chip and Cylindrical End Cap Components ................................................ | 8-109 | | | 8-110 | | 8.6.1.2 Gull Wing 8.6.1.3 J Lead ......................................................... | 8.6.1.2 Gull Wing 8.6.1.3 J Lead ......................................................... | | | 8-111 | | 8.6.1.5 Land | 8.6.1.5 Land | | ............................................................ | ............................................................ | | Component Damage ................................................ | 9-1 |

9.2

9.3

9.4

9.5

9.6

9.7

9.8

Chip Resistor Element

.......................................... 9-3

Leaded/Leadless Devices

..................................... 9-4

Ceramic Chip Capacitors

..................................... 9-8

Connectors

........................................................... 9-10

Relays

................................................................... 9-13

Magnetic Components

........................................ 9-13

Connectors, Handles, Extractors, Latches

9.9

....... 9-14

Edge Connector Pins

9.10

.......................................... 9-15

Press Fit Pins

..................................................... 9-16

9.11

9.12

9.13

Backplane Connector Pins

............................... 9-17

Heat Sink Hardware

.......................................... 9-18

Threaded Items and Hardware

........................ 9-19

10 Printed Circuit Boards and Assemblies

10.1

............. 10-1

Non-Soldered Contact Areas

10.1.1

........................... 10-2

Contamination ................................................ 10-2

10.1.2

Damage ......................................................... 10-4

10.2

Laminate Conditions

10.2.1

10.2.2

10.2.3

10.2.4

10.2.5

10.2.6

10.2.7

10.2.8

......................................... 10-4

Measling and Crazing

.................................... 10-5

Blistering and Delamination ............................ 10-7

Weave Texture/Weave Exposure

Haloing

................... 10-9

........................................................ 10-10

Edge Delamination, Nicks and Crazing

........ 10-12

Burns ........................................................... 10-14

Bow and Twist ............................................. 10-15

Depanelization .............................................. 10-16

10.3

Conductors/Lands

10.3.1

........................................... 10-18

Reduction

.................................................... 10-18

10.3.2

10.3.3

Lifted ............................................................ 10-19

Mechanical Damage

.................................... 10-21

10.4

Flexible and Rigid-Flex Printed Circuitry

10.4.1

...... 10-22

Damage ....................................................... 10-22

10.4.2

10.4.2.1

10.4.2.2

10.4.3

10.4.4

Delamination/Blister

..................................... 10-24

Flex

.............................................................. 10-24

Flex to Stiffener

............................................ 10-25

Solder Wicking ............................................. 10-26

Attachment

.................................................. 10-27

10.5

Marking

10.5.1

Table of Contents (cont.)

............................................................ 10-28

Etched (Including Hand Printing)

10.5.2

10.5.3

10.5.4

10.5.5

10.5.5.1

10.5.5.2

10.5.5.3

10.5.5.4

10.5.6

.................. 10-30

Screened

..................................................... 10-31

Stamped ...................................................... 10-33

Laser ............................................................ 10-34

Labels

.......................................................... 10-35

Bar Coding/Data Matrix

............................... 10-35

Readability

................................................... 10-36

Labels - Adhesion and Damage .................. 10-37

Position ........................................................ 10-37

Radio Frequency Identification

(RFID) Tags

10.6

.................................................. 10-38

Cleanliness

10.6.1

...................................................... 10-39

Flux Residues

10.6.2

10.6.3

10.6.4

10.6.5

.............................................. 10-40

Foreign Object Debris (FOD)

........................ 10-41

Chlorides, Carbonates and White

Residues ...................................................... 10-42

Flux Residues - No-Clean Process -

Appearance

................................................. 10-44

Surface Appearance

10.7

.................................... 10-45

Solder Mask Coating

10.7.1

....................................... 10-46

Wrinkling/Cracking

10.7.2

10.7.3

10.7.4

....................................... 10-47

Voids, Blisters, Scratches

............................ 10-49

Breakdown

.................................................. 10-50

Discoloration

................................................ 10-51

10.8

Conformal Coating

10.8.1

.......................................... 10-51

General

........................................................ 10-51

| 10.8.2 | Coverage ..................................................... | 10-52 | |----------------------------------------------------------------------------------------|----------------------------------------------------------------------------------------|----------------------------------------------| | 10.8.3 | Thickness ..................................................... | 10-54 | | 10.8.4 | Electrical Insulation Coating | ......................... 10-55 | | 10.8.4.1 | Coverage ..................................................... | 10-55 | | 10.8.4.2 | Thickness ..................................................... | 10-55 | | 10.9 Encapsulation | .................................................. | 10-56 | | 11 Discrete Wiring ..................................................... | 11 Discrete Wiring ..................................................... | 11-1 | | 11.1 Solderless Wrap | ................................................ | 11-2 | | 11.1.1 | Number of Turns ............................................ | 11-3 | | 11.1.2 | Turn Spacing ................................................. | 11-4 | | 11.1.3 | End Tails and Insulation Wrap | ........................ 11-5 | | 11.1.4 | Raised Turns Overlap | ..................................... 11-7 | | 11.1.5 | Connection Position | ....................................... 11-8 | | 11.1.6 | Wire Dress ................................................... | 11-10 | | 11.1.7 | Wire Slack .................................................... | 11-11 | | 11.1.8 | Wire Plating .................................................. | 11-12 | | 11.1.9 | Damaged Insulation ..................................... | 11-13 | | 11.1.10 | Damaged Conductors and Terminals | .......... 11-14 | | 12 High Voltage | ......................................................... | 12-1 | | Appendix A Minimum Electrical Clearance - Electrical Conductor Spacing ............... | Appendix A Minimum Electrical Clearance - Electrical Conductor Spacing ............... | A-1 | | Index ........................................................................ | Index ........................................................................ | Index-1 |

The following topics are addressed in this section:

1.1

...................................................................... 1-2

1.2

1.3

1.4

Scope

Purpose

................................................................... 1-3

Classification

......................................................... 1-3

Measurement Units and Applications

1.4.1 Verification of Dimensions

1.5

................. 1-3

...................................... 1-3

Definition of Requirements

1.5.1

.................................. 1-3

Acceptance Criteria .......................................... 1-4

1.5.1.1

1.5.1.2

1.5.1.3

1.5.1.3.1

1.5.1.4

1.5.1.5

1.5.1.6

1.5.1.7

Target Condition

.............................................. 1-4

Acceptable Condition ....................................... 1-4

Defect Condition

.............................................. 1-4

Disposition

....................................................... 1-4

Process Indicator Condition

............................. 1-4

Combined Conditions

...................................... 1-4

Conditions Not Specified

................................. 1-4

Specialized Designs

......................................... 1-5

1.6

Process Control Methodologies

1.7

........................... 1-5

Order of Precedence

1.7.1

............................................. 1-5

Clause References ........................................... 1-5

1.7.2

Appendices ...................................................... 1-5

1.8

Terms and Definitions

1.8.1

........................................... 1-5

Board Orientation ............................................. 1-5

General

| 1.8.1.1 | *Primary Side .................................................... | 1-5 | |-----------------------------|-----------------------------------------------------------------------|-------| | 1.8.1.2 | *Secondary Side ............................................... | 1-5 | | 1.8.1.3 | Solder Source Side .......................................... | 1-5 | | 1.8.1.4 | Solder Destination Side .................................... | 1-5 | | 1.8.2 | *Cold Solder Connection ................................... | 1-6 | | 1.8.3 | Diameter .......................................................... | 1-6 | | 1.8.4 | Electrical Clearance .......................................... | 1-6 | | 1.8.5 | FOD (Foreign Object Debris) | 1-6 | | 1.8.6 | High Voltage .................................................... | 1-6 | | 1.8.7 | Intrusive Solder ................................................ | 1-6 | | 1.8.8 | Locking Mechanism ......................................... | 1-6 | | 1.8.9 | Meniscus (Component) .................................... | 1-6 | | 1.8.10 | *Nonfunctional Land .......................................... | 1-6 | | 1.8.11 | Pin-in-Paste ..................................................... | 1-6 | | 1.8.12 | Solder Balls ...................................................... | 1-6 | | 1.8.13 | *Stress Relief ..................................................... | 1-6 | | 1.8.14 | Wire Overlap .................................................... | 1-6 | | 1.8.15 | Wire Overwrap ................................................. | 1-6 | | 1.9 Requirements Flowdown | ...................................... | 1-6 | | 1.10 Personnel Proficiency | ......................................... | 1-7 | | 1.11 | Acceptance Requirements ................................. | 1-7 | | 1.12 Inspection Methodology | ..................................... | 1-7 | | 1.12.1 | Lighting ............................................................ | 1-7 | | 1.12.2 | Magnification Aids ............................................ | 1-7 |

General (cont.)

1.1 Scope This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation.

This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPCHDBK-001, IPC-AJ-820 and IPC J-STD-001.

The criteria in this Standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer's product. For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction.

Users of this Standard should be knowledgeable of the applicable requirements of the document and how to apply them, see 1.3.

IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling, mechanical and other workmanship requirements. Table 1-1 is a summary of related documents.

IPC-AJ-820 is a supporting document that provides information regarding the intent of this specification content and explains or amplifies the technical rationale for transition of limits through Target to Defect condition criteria. In addition, supporting information is provided to give a broader understanding of the process considerations that are related to performance but not commonly distinguishable through visual assessment methods.

Table 1-1 Summary of Related Documents

| Document Purpose | Spec.# | Definition | |--------------------------------------------|-----------------------------------|-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------| | Design Standard | IPC-2220-FAM IPC-7351 IPC-CM-C770 | Design requirements reflecting three levels of complexity (Levels A, B, and C) indicating finer geometries, greater densities, more process steps to produce the product. Component and Assembly Process Guidelines to assist in the design of the bare board and the assembly where the bare board processes concentrate on land pat- terns for surface mount and the assembly concentrates on surface mount and through-hole principles which are usually incorporated into the design process and the documentation. | | PCB - Printed Circuit Board - Requirements | IPC-6010-FAM IPC-A-600 | Requirements and acceptance documentation for rigid, rigid flex, flex and other types of substrates. | | End Item Documentation | IPC-D-325 | Documentation depicting bare board specific end product requirements designed by the customer or end item assembly requirements. Details may or may not refer- ence industry specifications or workmanship standards as well as customer's own preferences or internal standard requirements. | | Process Requirement Standard | J-STD-001 | Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable ability of process control require- ments. | | Acceptability Standard | IPC-A-610 | Pictorial interpretive document indicating various characteristics of the board and/or assembly as appropriate relating to desirable conditions that exceed the minimum acceptable characteristics indicated by the end item performance standard and reflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action. | | Training Programs (Optional) | | Documented training requirements for teaching and learning process procedures and techniques for implementing acceptance requirements of either end item standards, acceptability standards, or requirements detailed on the customer documentation. | | Rework and Repair | IPC-7711/7721 | Documentation providing the procedures to accomplish conformal coating and component removal and replacement, solder resist repair, and modification/repair of laminate material, conductors, and plated through-holes. |